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| Designed for versatility, The Imaging Source's embedded vision platform supports single and dual-camera applications via our modular board concept and Toradex Verdin SoM. The integration of our MIPI CSI-2 camera portfolio with robust industrial-grade computing enables precise application development, ensuring efficient turnaround of application-specific design changes that saves development time and related costs. |
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| 36S MIPI CSI-2 Cameras |
| Optimized for cost and high-volume embedded vision projects, these compact, single-board camera modules offer reliable and efficient sensor-to-ISP connection supporting up to four image data lanes with a total throughput of up to 10 Gb/sec. The 22-pin cameras are compatible with The Imaging Source's NXP® i.MX 8M Plus SoM carrier board and many other processor boards. |
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| 36C FPD Link III Cameras |
| The Imaging Source's FPD-Link III cameras feature the latest sensors from onsemi and Sony and are compatible with a wide range of M12 and C/CS lenses. These cameras offer the full functionality of MIPI CSI-2 cameras and allow cable lengths of up to 15m between sensor and computer platform. They are available as board and IP67 form factors. |
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| Embedded System Design: Top Challenges and Solutions from Sensor to Application |
| On December 4, The Imaging Source's Senior Product Manager, Momchil Binev, will present during inVISION's TechTalks webinar as part of the inVISION Days Conference. The second day of the free, online conference focuses on Embedded Vision and AI. Mr. Binev will present "Embedded System Design - Top Challenges and Solutions from Sensor to Application" highlighting typical challenges encountered when designing embedded vision systems. |
| Register Now |
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